1. Thermoelectric Infrared Sensor Integrated with SHA Absorber

This paper details the design of a high-performance thermoelectric infrared (IR) sensor using the UMC 0.18 μm CMOS-MEMS process, targeting the 8–14 μm wavelength for applications like IoT. To enhance performance, the sensor integrates two key innovations: a Sub-Wavelength Hole Array (SHA) absorber and a novel double-layer thermopile structure with 64 pairs of thermocouples. Finite-Difference Time-Domain (FDTD) simulations show the SHA structure achieves an average IR absorptivity of... Z. Dai